Title:
RESIN COMPOSITION, AND RESIN SHEET, PREPREG, LAMINATE, METAL SUBSTRATE AND PRINTED CIRCUIT BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/065159
Kind Code:
A1
Abstract:
A resin composition comprising: a first filler having an average particle diameter (D50) of 1 nm to 500 nm corresponding to 50% cumulation from the smallest particle diameter side in a weight cumulative particle size distribution, and including α-alumina; a second filler having an average particle diameter (D50) of 1 μm to 100 μm corresponding to 50% cumulation from the smallest particle diameter side in a weight cumulative particle size distribution; and a thermosetting resin including a mesogenic group within each molecule.
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Inventors:
YOSHIDA YUKA (JP)
TAKEZAWA YOSHITAKA (JP)
MIYAZAKI YASUO (JP)
TAKAHASHI HIROYUKI (JP)
TAKEZAWA YOSHITAKA (JP)
MIYAZAKI YASUO (JP)
TAKAHASHI HIROYUKI (JP)
Application Number:
PCT/JP2011/075345
Publication Date:
May 10, 2013
Filing Date:
November 02, 2011
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
YOSHIDA YUKA (JP)
TAKEZAWA YOSHITAKA (JP)
MIYAZAKI YASUO (JP)
TAKAHASHI HIROYUKI (JP)
YOSHIDA YUKA (JP)
TAKEZAWA YOSHITAKA (JP)
MIYAZAKI YASUO (JP)
TAKAHASHI HIROYUKI (JP)
International Classes:
C08L101/00; B32B15/08; C08J5/24; C08K3/22; C08L63/00; H01B3/00; H01B3/40
Domestic Patent References:
| WO2011040415A1 | 2011-04-07 | |||
| WO2011040416A1 | 2011-04-07 |
Foreign References:
| JP2008213426A | 2008-09-18 | |||
| JP2011012193A | 2011-01-20 | |||
| JP2011090868A | 2011-05-06 | |||
| JP2011208007A | 2011-10-20 | |||
| JP2008266378A | 2008-11-06 | |||
| JP2009274929A | 2009-11-26 | |||
| JP2011177929A | 2011-09-15 |
Attorney, Agent or Firm:
HIZATATE, Shoji et al. (JP)
膝舘 Yoshiharu (JP)
膝舘 Yoshiharu (JP)
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Claims: