Title:
RESIN COMPOSITION, SHEET-SHAPED RESIN COMPOSITION INTEGRATED WITH REAR-SURFACE GRINDING TAPE, SHEET-SHAPED RESIN COMPOSITION INTEGRATED WITH DICING TAPE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/152271
Kind Code:
A1
Abstract:
The present invention is a resin composition used to seal an interface between an adherend and a semiconductor element that is flipchip-bonded to the adherend, wherein the resin composition contains a radical reactive compound, a thermoplastic resin, and an inorganic filler, and the proportion of the radical reactive compound relative to the constituents of the entire resin composition, excluding the inorganic filler, is 18.5 weight% or more.
Inventors:
FUKUI AKIHIRO (JP)
TAKAMOTO NAOHIDE (JP)
HANAZONO HIROYUKI (JP)
TAKAMOTO NAOHIDE (JP)
HANAZONO HIROYUKI (JP)
Application Number:
PCT/JP2016/053341
Publication Date:
September 29, 2016
Filing Date:
February 04, 2016
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L21/60; C09J4/00; C09J7/20; C09J11/04; C09J133/00; C09J163/00; C09J201/00
Foreign References:
| JP2014145028A | 2014-08-14 | |||
| JP2012244115A | 2012-12-10 | |||
| JP2010287848A | 2010-12-24 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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