Title:
RESIN COMPOSITION, RESIN SHEET, RESIN SHEET WITH METAL FOIL, HARDENED RESIN SHEET, STRUCTURE, AND SEMICONDUCTOR DEVICE FOR POWER OR LIGHT SOURCE
Document Type and Number:
WIPO Patent Application WO/2013/030998
Kind Code:
A1
Abstract:
This resin composition contains an epoxy resin containing a multifunctional epoxy resin, a curing agent containing a novolac resin having a structural unit represented by general formula (I), and an inorganic filler containing nitride particles. In general formula (I): R1 and R2 each independently represent a hydrogen atom or a methyl group; m has an average value of 1.5 to 2.5; and n has an average value of 1 to 15.
Inventors:
TAKAHASHI HIROYUKI (JP)
NISHIYAMA TOMOO (JP)
SHIRASAKA TOSHIAKI (JP)
KUWANO ATSUSHI (JP)
TAKEZAWA YOSHITAKA (JP)
NISHIYAMA TOMOO (JP)
SHIRASAKA TOSHIAKI (JP)
KUWANO ATSUSHI (JP)
TAKEZAWA YOSHITAKA (JP)
Application Number:
PCT/JP2011/069845
Publication Date:
March 07, 2013
Filing Date:
August 31, 2011
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
TAKAHASHI HIROYUKI (JP)
NISHIYAMA TOMOO (JP)
SHIRASAKA TOSHIAKI (JP)
KUWANO ATSUSHI (JP)
TAKEZAWA YOSHITAKA (JP)
TAKAHASHI HIROYUKI (JP)
NISHIYAMA TOMOO (JP)
SHIRASAKA TOSHIAKI (JP)
KUWANO ATSUSHI (JP)
TAKEZAWA YOSHITAKA (JP)
International Classes:
C08G59/62; C08K3/28; C08L63/00
Domestic Patent References:
| WO2011040415A1 | 2011-04-07 | |||
| WO2011040416A1 | 2011-04-07 |
Foreign References:
| JPH03258829A | 1991-11-19 | |||
| JPH03258830A | 1991-11-19 | |||
| JP2009035484A | 2009-02-19 | |||
| JPH09328610A | 1997-12-22 | |||
| JPH04173828A | 1992-06-22 |
Attorney, Agent or Firm:
HIZATATE, Shoji et al. (JP)
膝舘 Yoshiharu (JP)
膝舘 Yoshiharu (JP)
Download PDF:
Claims:
Previous Patent: EXTENSION/RETRACTION DEVICE
Next Patent: METHOD FOR MANUFACTURING LIQUID-CRYSTAL PANEL
Next Patent: METHOD FOR MANUFACTURING LIQUID-CRYSTAL PANEL