Title:
RESIN COMPOSITION, RESIN SHEET WITH SUPPORT, MULTILAYERED PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/126536
Kind Code:
A1
Abstract:
Provided are: a resin composition which, when used to produce a multilayered printed wiring board, imparts excellent heat resistance and developability; a resin sheet having a support attached thereto; a multilayered printed wiring board including same; and a semiconductor device. The resin composition comprises a compound (A) represented by formula (1) and having an acid value of 30-120 mg-KOH/g, a photocuring initiator (B), and a maleimide compound (C) and/or a blocked isocyanate (D).
Inventors:
SUZUKI TAKUYA (JP)
KITAMURA SHINYA (JP)
SHIKA SEIJI (JP)
KITAMURA SHINYA (JP)
SHIKA SEIJI (JP)
Application Number:
PCT/JP2017/001510
Publication Date:
July 27, 2017
Filing Date:
January 18, 2017
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08F290/06; C08F220/30; C08F222/40; C08G18/80; G03F7/004; G03F7/027; H05K3/46
Domestic Patent References:
| WO2011010457A1 | 2011-01-27 |
Foreign References:
| JP2011256271A | 2011-12-22 | |||
| JP2010224169A | 2010-10-07 | |||
| JPH03100009A | 1991-04-25 | |||
| JP2013068896A | 2013-04-18 | |||
| JP2014074927A | 2014-04-24 | |||
| JP2015064546A | 2015-04-09 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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