Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION, RESIN SHEET WITH SUPPORT, MULTILAYERED PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/126536
Kind Code:
A1
Abstract:
Provided are: a resin composition which, when used to produce a multilayered printed wiring board, imparts excellent heat resistance and developability; a resin sheet having a support attached thereto; a multilayered printed wiring board including same; and a semiconductor device. The resin composition comprises a compound (A) represented by formula (1) and having an acid value of 30-120 mg-KOH/g, a photocuring initiator (B), and a maleimide compound (C) and/or a blocked isocyanate (D).

Inventors:
SUZUKI, Takuya (Inc. Tokyo Techno Park, 1-1, Niijuku 6-chome, Katsushika-k, Tokyo 01, 〒1258601, JP)
KITAMURA, Shinya (Inc. Tokyo Techno Park, 1-1, Niijuku 6-chome, Katsushika-k, Tokyo 01, 〒1258601, JP)
SHIKA, Seiji (Inc. Tokyo Techno Park, 1-1, Niijuku 6-chome, Katsushika-k, Tokyo 01, 〒1258601, JP)
Application Number:
JP2017/001510
Publication Date:
July 27, 2017
Filing Date:
January 18, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC. (5-2 Marunouchi 2-chome, Chiyoda-ku Tokyo, 24, 〒1008324, JP)
International Classes:
C08F290/06; C08F220/30; C08F222/40; C08G18/80; G03F7/004; G03F7/027; H05K3/46
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (TMI ASSOCIATES, 23rd Floor Roppongi Hills Mori Tower, 6-10-1, Roppongi, Minato-k, Tokyo 23, 〒1066123, JP)
Download PDF:



 
Previous Patent: TRANSPORT EQUIPMENT AND CONNECTOR

Next Patent: PRINTER