Title:
RESIN COMPOSITION AND RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2018/168715
Kind Code:
A1
Abstract:
A resin composition that contains a thermosetting component (A). The resin composition is characterized in that the thermosetting component (A) contains a maleimide resin (A1). The resin composition is also characterized in that there are at least two maleimide groups per molecule of the maleimide resin (A1). The resin composition is also characterized in that, before the resin composition has been cured, the complex viscosity η of the resin composition at 90℃ is 1.0×102– 1.0×104 Pa∙s.
Inventors:
KARASAWA YASUNORI (JP)
Application Number:
PCT/JP2018/009320
Publication Date:
September 20, 2018
Filing Date:
March 09, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C08L35/02; C08K3/36; C08L29/10; H01L23/29; H01L23/31
Domestic Patent References:
| WO2017110373A1 | 2017-06-29 | |||
| WO1998044067A1 | 1998-10-08 | |||
| WO2016072404A1 | 2016-05-12 |
Foreign References:
| JP2009161725A | 2009-07-23 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
Download PDF:
Previous Patent: OXIME ESTER COMPOUND AND PHOTOPOLYMERIZATION INITIATOR CONTAINING SAID COMPOUND
Next Patent: ROD ASSEMBLY AND SUPERCHARGER
Next Patent: ROD ASSEMBLY AND SUPERCHARGER