Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION FOR STEREOLITHOGRAPHY
Document Type and Number:
WIPO Patent Application WO/2021/162007
Kind Code:
A1
Abstract:
The present invention provides a resin composition for stereolithography, the resin composition excelling in strength of a molded object, toughness and water resistance. The present invention pertains to a resin composition for stereolithography, the resin composition comprising a urethanized (meth)acrylic compound (A), a (meth)acrylate compound (B) not containing a urethane bond, and a photopolymerization initiator (C). The compound (A) is a urethanized (meth)acrylic compound (A-1) having a polymer structure and/or a urethanized (meth)acrylic compound (A-2) not having a polymer structure. The weight average molecular weight of the compound (A-1) is less than 1000, and the molecular weight of the compound (A-2) is less than 1000. The compound (B) includes at least one selected from the group consisting of a (meth)acrylate compound (b-I) represented by general formula (I) and a (meth)acrylate compound (b-II) represented by general formula (II).

Inventors:
SUZUKI KENJI (JP)
ITO MISAKI (JP)
Application Number:
PCT/JP2021/004832
Publication Date:
August 19, 2021
Filing Date:
February 09, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KURARAY NORITAKE DENTAL INC (JP)
International Classes:
C08F290/06; A61C11/00; A61C13/01; A61K6/30; B29C64/124; B29C64/314; B33Y10/00; B33Y70/00; B33Y80/00
Domestic Patent References:
WO2012011434A12012-01-26
WO2019189566A12019-10-03
WO2018181833A12018-10-04
WO2020071552A12020-04-09
WO2020218446A12020-10-29
WO2019189566A12019-10-03
Foreign References:
JP2019534804A2019-12-05
JP2010189534A2010-09-02
JP2019001939A2019-01-10
JP2019099750A2019-06-24
JPS56144478A1981-11-10
JPS60247515A1985-12-07
JP2000159621A2000-06-13
Other References:
See also references of EP 4105250A4
Attorney, Agent or Firm:
KAMADA Koichi et al. (JP)
Download PDF: