Title:
RESIN COMPOSITION FOR STEREOLITHOGRAPHY
Document Type and Number:
WIPO Patent Application WO/2021/162007
Kind Code:
A1
Abstract:
The present invention provides a resin composition for stereolithography, the resin composition excelling in strength of a molded object, toughness and water resistance. The present invention pertains to a resin composition for stereolithography, the resin composition comprising a urethanized (meth)acrylic compound (A), a (meth)acrylate compound (B) not containing a urethane bond, and a photopolymerization initiator (C). The compound (A) is a urethanized (meth)acrylic compound (A-1) having a polymer structure and/or a urethanized (meth)acrylic compound (A-2) not having a polymer structure. The weight average molecular weight of the compound (A-1) is less than 1000, and the molecular weight of the compound (A-2) is less than 1000. The compound (B) includes at least one selected from the group consisting of a (meth)acrylate compound (b-I) represented by general formula (I) and a (meth)acrylate compound (b-II) represented by general formula (II).
Inventors:
SUZUKI KENJI (JP)
ITO MISAKI (JP)
ITO MISAKI (JP)
Application Number:
PCT/JP2021/004832
Publication Date:
August 19, 2021
Filing Date:
February 09, 2021
Export Citation:
Assignee:
KURARAY NORITAKE DENTAL INC (JP)
International Classes:
C08F290/06; A61C11/00; A61C13/01; A61K6/30; B29C64/124; B29C64/314; B33Y10/00; B33Y70/00; B33Y80/00
Domestic Patent References:
WO2012011434A1 | 2012-01-26 | |||
WO2019189566A1 | 2019-10-03 | |||
WO2018181833A1 | 2018-10-04 | |||
WO2020071552A1 | 2020-04-09 | |||
WO2020218446A1 | 2020-10-29 | |||
WO2019189566A1 | 2019-10-03 |
Foreign References:
JP2019534804A | 2019-12-05 | |||
JP2010189534A | 2010-09-02 | |||
JP2019001939A | 2019-01-10 | |||
JP2019099750A | 2019-06-24 | |||
JPS56144478A | 1981-11-10 | |||
JPS60247515A | 1985-12-07 | |||
JP2000159621A | 2000-06-13 |
Other References:
See also references of EP 4105250A4
Attorney, Agent or Firm:
KAMADA Koichi et al. (JP)
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