Title:
RESIN COMPOSITION, SURFACE TREATMENT METHOD, AND METHOD FOR PRODUCING MATERIAL INCLUDING CURED COATING FILM
Document Type and Number:
WIPO Patent Application WO/2024/004918
Kind Code:
A1
Abstract:
A resin composition which overcomes defects of prior-art techniques and is less odorous and excellent in terms of crack resistance in a cooling/heating cycle test, chemical resistance, and air dryability is provided without using any copolymerizable monomers subjected to many restrictions, such as styrene. This resin composition comprises components (a) to (c). The component (a) is at least one compound having, in the molecule, both a terminal structure of formula (1) and an organic residue derived from one or more compounds selected from the group consisting of dimer acids, which are each a dimer of an unsaturated fatty acid having 18 carbon atoms, trimer acids, which are each a trimer of an unsaturated fatty acid having 18 carbon atoms, and products of hydrogenation of these. The component (b) has, in the molecule, both a structure derived from a novolak type phenol resin and a terminal structure of formula (1). The component (c) is a reactive diluent. (In the formula, R1 represents H or CH3 and the broken line indicates a combining site.)
Inventors:
OGA KAZUHIKO (JP)
KUBO TETSUYA (JP)
YAMASHITA MATORU (JP)
KUBO TETSUYA (JP)
YAMASHITA MATORU (JP)
Application Number:
PCT/JP2023/023499
Publication Date:
January 04, 2024
Filing Date:
June 26, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08F290/14; C08F283/01; C09D167/04; C09D167/06
Foreign References:
| JPH0733961A | 1995-02-03 | |||
| JP2005120340A | 2005-05-12 | |||
| JP2000317909A | 2000-11-21 | |||
| JP2004143455A | 2004-05-20 | |||
| JP2003128739A | 2003-05-08 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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