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Title:
RESIN COMPOSITION FOR TEMPERATURE SENSOR, ELEMENT FOR TEMPERATURE SENSOR, TEMPERATURE SENSOR, AND METHOD FOR PRODUCING ELEMENT FOR TEMPERATURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2015/119205
Kind Code:
A1
Abstract:
In order to provide a resin composition for a temperature sensor that comprises a polymer and has high flexibility, higher sensitivity, and high repeated reproducibility, an element for a temperature sensor, a temperature sensor, and a method for producing the temperature sensor, the resin composition (10) for a temperature sensor is configured to have conductive particles (2) dispersed in an acrylic polymer (1) in which a first acrylic monomer represented by general formula CH2CHCOOX1 and a second acrylic monomer represented by general formula CH2CHCOOX2 have been copolymerized.

Inventors:
SEKITANI TSUYOSHI (JP)
TERAKAWA YUKI (JP)
YOKOTA TOMOYUKI (JP)
SOMEYA TAKAO (JP)
REEDER JONATHAN T (JP)
Application Number:
PCT/JP2015/053272
Publication Date:
August 13, 2015
Filing Date:
February 05, 2015
Export Citation:
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Assignee:
JAPAN SCIENCE & TECH AGENCY (JP)
International Classes:
H01C7/02; C08K3/04; C08L33/08; C09D7/61; H01C17/06
Domestic Patent References:
WO2010110331A12010-09-30
Foreign References:
JP2006013378A2006-01-12
US20130070380A12013-03-21
JPH11176614A1999-07-02
JP2005082717A2005-03-31
JP2000049004A2000-02-18
Other References:
See also references of EP 3104376A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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