Title:
RESIN COMPOSITION FOR TEMPORARY FIXING USE, RESIN FILM FOR TEMPORARY FIXING USE, SHEET FOR TEMPORARY FIXING USE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/129917
Kind Code:
A1
Abstract:
A resin composition for temporary fixing use according to the present invention can be used for the formation of a temporary fixing material for use in a semiconductor wafer processing method comprising a temporary fixing step of temporarily fixing the semiconductor wafer onto a support with the temporary fixing material interposed therebetween, a processing step of processing the semiconductor wafer that has been temporarily fixed onto the support, and a separation step of separating the processed semiconductor wafer from the temporary fixing material, the resin composition comprising (A) a thermoplastic resin, (B) a heat-curable resin and (C) a silicone compound, and having a shear viscosity of 4000 Pa・s or less at 120°C, wherein the change ratio of the shear viscosity of the resin composition after the resin composition is allowed to leave under an atmosphere having a temperature of 25°C for seven days is within 30%.
Inventors:
SOBUE SHOGO (JP)
OOYAMA YASUYUKI (JP)
YAMAGUCHI YUSHI (JP)
OOYAMA YASUYUKI (JP)
YAMAGUCHI YUSHI (JP)
Application Number:
PCT/JP2019/049245
Publication Date:
June 25, 2020
Filing Date:
December 16, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J133/04; C09J161/04; C09J163/00; H01L21/02
Domestic Patent References:
| WO2016035821A1 | 2016-03-10 | |||
| WO2017191815A1 | 2017-11-09 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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