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Title:
RESIN COMPOSITION AND THERMALLY CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2021/117356
Kind Code:
A1
Abstract:
A resin composition according to the present invention contains an epoxy resin, a curing agent, and an inorganic filler, the inorganic filler being dispersed in the epoxy resin, wherein the epoxy resin includes a tetramethyl-bisphenol-F-type epoxy resin, and the curing agent includes a trisphenol-type phenol resin.

Inventors:
TABUCHI AKIHIRO (JP)
Application Number:
PCT/JP2020/039879
Publication Date:
June 17, 2021
Filing Date:
October 23, 2020
Export Citation:
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Assignee:
NITTO SHINKO CORP (JP)
International Classes:
C08G59/24; C08L63/02
Foreign References:
JP2018016669A2018-02-01
JP2017203132A2017-11-16
JP2018172545A2018-11-08
JPH11209729A1999-08-03
JP2017095570A2017-06-01
JP2011231143A2011-11-17
JP2012092158A2012-05-17
JP2014005345A2014-01-16
JPH111544A1999-01-06
JP2017186453A2017-10-12
JP2016138194A2016-08-04
JP2014148579A2014-08-21
JPH0870185A1996-03-12
JP2003261647A2003-09-19
JP2010094887A2010-04-30
Other References:
See also references of EP 4074746A4
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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