Title:
RESIN COMPOSITION FOR UNDERFILL, AND ELECTRONIC COMPONENT DEVICE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/239554
Kind Code:
A1
Abstract:
A resin composition for underfills which comprises an epoxy resin, a hardener, an inorganic filler, and one or more silicone compounds including a polyglycerin-modified silicone compound and/or a polyester-modified silicone compound.
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Inventors:
KOIKE DAIKI (JP)
Application Number:
PCT/JP2022/015660
Publication Date:
November 17, 2022
Filing Date:
March 29, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08G59/00; H01L21/60; H01L23/29; H01L23/31
Foreign References:
| JP2019135311A | 2019-08-15 | |||
| JP2009024041A | 2009-02-05 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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