Title:
RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, LAYERED PRODUCT, METHOD FOR FORMING PATTERN, AND PROCESS FOR PRODUCING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/194507
Kind Code:
A1
Abstract:
Provided are a resin composition for underlayer film formation which can form an underlayer film having satisfactory adhesiveness and excellent surface flatness, a layered product, a method for forming a pattern, and a process for producing a device.
The resin composition for underlayer film formation comprises: a resin having a group represented by general formula (A) and a group represented by general formula (B); and a solvent. Ra1 represents a hydrogen atom or a methyl group; Rb1 and Rb2 each independently represent a group selected from among C1-20 linear or branched unsubstituted alkyl groups and C3-20 unsubstituted cycloalkyl groups; Rb3 represents a group selected from among C2-20 linear or branched unsubstituted alkyl groups and C3-20 unsubstituted cycloalkyl groups; and Rb2 and Rb3 may have been bonded to each other to form a ring.
Inventors:
KITAGAWA HIROTAKA (JP)
OOMATSU TADASHI (JP)
OOMATSU TADASHI (JP)
Application Number:
PCT/JP2015/067194
Publication Date:
December 23, 2015
Filing Date:
June 15, 2015
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F8/14; B32B27/30; C08F299/02
Domestic Patent References:
| WO2011086757A1 | 2011-07-21 |
Foreign References:
| JP2014090133A | 2014-05-15 | |||
| JP2014024322A | 2014-02-06 | |||
| JP2013093552A | 2013-05-16 | |||
| JP2010020109A | 2010-01-28 | |||
| JP2008189747A | 2008-08-21 | |||
| JP2003183332A | 2003-07-03 | |||
| JPH05273799A | 1993-10-22 | |||
| JPH01178512A | 1989-07-14 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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