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Title:
RESIN COMPOSITION FOR USE IN COATED MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2010/131730
Kind Code:
A1
Abstract:
Disclosed is a resin composition for use in a coated molded article containing (A) 35 to 90% by mass of a polyamide resin, (B) 9 to 50% by mass of an ABS resin, and (C) 1 to 25% by mass in total of two or more resins selected from a carboxylic acid-modified AS resin, a carboxylic acid-modified acrylic resin, a carboxylic acid-modified maleimide resin, a carboxylic acid-modified ABS resin, and a carboxylic acid-modified SEBS resin, and further containing (D) glass fibers and/or carbon fibers in an amount of 2 to 80 parts by mass with respect to 100 parts by mass of the total amount of the components (A), (B), and (C).

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Inventors:
TAI TOSHIHIRO (JP)
OE YUICHI (JP)
Application Number:
PCT/JP2010/058155
Publication Date:
November 18, 2010
Filing Date:
May 14, 2010
Export Citation:
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Assignee:
DAICEL POLYMER LTD (JP)
TAI TOSHIHIRO (JP)
OE YUICHI (JP)
International Classes:
C08L77/00; C08K7/04; C08L55/02
Foreign References:
JP2007161940A2007-06-28
JP2007224287A2007-09-06
JPH11286587A1999-10-19
JP2005307180A2005-11-04
JP2004131716A2004-04-30
JP2007224287A2007-09-06
JPH11286587A1999-10-19
Other References:
See also references of EP 2431418A4
Attorney, Agent or Firm:
FURUYA Satoshi et al. (JP)
Satoshi Furuya (JP)
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Claims: