Title:
RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/012415
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a resin composition from which a resin molded article having excellent production stability and weight reduction efficiency can be produced; and a use of the resin composition.
The resin composition comprises hollow particles (A) and an organic base resin (B), wherein each of the hollow particles (A) is an expanded body of a thermally expandable microsphere, the thermally expandable microsphere is composed of a shell part made from a thermoplastic resin and a foaming agent enclosed in the shell part and capable of being vaporized by heating, and the volume proportion (P) of air in the hollow particles (A) is 30% or more wherein the total volume of the hollow particle (A) is 100%.
Inventors:
MIKI KATSUSHI (JP)
TAYAGAKI NAOYA (JP)
TAYAGAKI NAOYA (JP)
Application Number:
PCT/JP2017/024888
Publication Date:
January 18, 2018
Filing Date:
July 07, 2017
Export Citation:
Assignee:
MATSUMOTO YUSHI-SEIYAKU CO LTD (JP)
International Classes:
C08L101/00; C08J9/32; C08K7/22; C09D201/02; C09J11/00; C09J201/02
Domestic Patent References:
| WO2007049616A1 | 2007-05-03 |
Foreign References:
| JP2014065893A | 2014-04-17 | |||
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| JP2013173945A | 2013-09-05 | |||
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| JP2013237815A | 2013-11-28 | |||
| JP2015137332A | 2015-07-30 | |||
| JP2016130308A | 2016-07-21 | |||
| US20100047550A1 | 2010-02-25 | |||
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| JP2011510113A | 2011-03-31 |
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