Title:
RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/084084
Kind Code:
A1
Abstract:
Provided are: a resin composition excellent in terms of all of improvement in pattern shape, prevention of residue defects, and prevention of water mark defects; and a method for forming a resist pattern. The resin composition comprises: resin A, which contains sulfonic-acid-group-containing structural units in an amount exceeding 5 mol% and contains fluorine atoms in an amount per unit mass of 30 mass% or less; resin C, which contains fluorine atoms in a larger amount per unit mass than in resin A; and a solvent. In the resin composition, the content of the resin A is lower than the content of the resin C.
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Inventors:
SAKURAI TOMOHIKO (JP)
OSAWA SOSUKE (JP)
NAKASHIMA HIROMITSU (JP)
OSAWA SOSUKE (JP)
NAKASHIMA HIROMITSU (JP)
Application Number:
PCT/JP2017/038925
Publication Date:
May 11, 2018
Filing Date:
October 27, 2017
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
C08L101/06; C08L101/04; C08L101/08; G03F7/039; G03F7/11; G03F7/38; H01L21/027
Domestic Patent References:
| WO2012043762A1 | 2012-04-05 | |||
| WO2013069750A1 | 2013-05-16 | |||
| WO2013047044A1 | 2013-04-04 | |||
| WO2009041270A1 | 2009-04-02 |
Foreign References:
| JP2014071389A | 2014-04-21 | |||
| JP2011215405A | 2011-10-27 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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