Title:
RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/134228
Kind Code:
A1
Abstract:
The present invention relates to a resin composition and the use thereof. The resin composition comprises, in parts by weight, the following components: a thermosetting polyphenylene ether resin, a crosslinking agent, an epoxy silane oligomer, and a free radical initiator, wherein the crosslinking agent comprises a polyolefin resin with an unsaturated double bond; and the epoxy silane oligomer has a structure as represented by formula I. In the present invention, by means of the addition of the epoxy silane oligomer to a polyphenylene ether + polyolefin resin system, not only can the peeling strength and the interlayer bonding force be effectively improved, but the peeling strength and interlayer bonding force of a plate are also not affected by a temperature change during processing due to the fact that the epoxy silane oligomer is not readily volatile, such that the stability of the peeling strength and the interlayer bonding force are ensured, while the dielectric properties and the heat resistance of the plate are not affected.
Inventors:
GUAN CHIJI (CN)
ZENG XIANPING (CN)
CHEN GUANGBING (CN)
XU YONGJING (CN)
ZENG XIANPING (CN)
CHEN GUANGBING (CN)
XU YONGJING (CN)
Application Number:
PCT/CN2021/070868
Publication Date:
June 30, 2022
Filing Date:
January 08, 2021
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
B32B17/04; C08L71/12; B32B17/06; B32B33/00; C08J5/24; C08K5/5435; C08L9/00; C08L83/00; H05K1/03
Foreign References:
| CN102807658A | 2012-12-05 | |||
| CN109971152A | 2019-07-05 | |||
| CN110869403A | 2020-03-06 | |||
| CN110312762A | 2019-10-08 | |||
| CN111253702A | 2020-06-09 | |||
| JP2020002217A | 2020-01-09 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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