Title:
RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/020222
Kind Code:
A1
Abstract:
A resin composition and the use thereof. The resin composition comprises the following components, in percentages by weight: 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler is silicon dioxide prepared by means of an organosilicone hydrolysis method; the average particle size D50 of the silicon dioxide is 0.1-3μm; and the particle size ratio D100:D10 of the silicon dioxide is less than or equal to 2.5. By means of the composition, a prepared adhesive film and resin-coated copper foil have a higher elongation rate, a higher peel strength, low CTE, low Df, better drilling processability and higher electrical strength. A finer line processing capability can be achieved, which can be applied to a printed circuit board material of a multilayer laminate, in particular a printed circuit board material of a multilayer laminate of thin lines.
Inventors:
WANG QING (CN)
LIU QIANFA (CN)
LIU DONGLIANG (CN)
DONG JINCHAO (CN)
CHAI SONGGANG (CN)
XU YONGJING (CN)
ZHANG YANHUA (CN)
LIU QIANFA (CN)
LIU DONGLIANG (CN)
DONG JINCHAO (CN)
CHAI SONGGANG (CN)
XU YONGJING (CN)
ZHANG YANHUA (CN)
Application Number:
PCT/CN2022/108221
Publication Date:
February 23, 2023
Filing Date:
July 27, 2022
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L61/06; B32B15/14; B32B15/20; B32B17/02; B32B27/04; C08K3/36; C08L63/00; C08L71/12; C08L79/04; C08L79/08
Domestic Patent References:
| WO2019189219A1 | 2019-10-03 |
Foreign References:
| CN113621216A | 2021-11-09 | |||
| EP0257611A2 | 1988-03-02 | |||
| US5674589A | 1997-10-07 | |||
| JP2019179222A | 2019-10-17 | |||
| CN111303667A | 2020-06-19 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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