Title:
RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/090308
Kind Code:
A1
Abstract:
[Problem] To provide a resin composition that not only has excellent defoaming properties but also has excellent foam suppressing properties. [Solution] A resin composition containing a resin (X) (excluding a copolymer (Y) described later) and an ethylene-α-olefin copolymer (Y) that satisfies the following conditions (y-1) and (y-2). (y-1) The solubility parameter, calculated on the basis of the D. W. Van Krevelen estimation method, is 15.5-16.3 (MPa)1/2. (y-2) The weight-average molecular weight (Mw), determined by gel permeation chromatography (GPC), is 1,500-30,000.
Inventors:
TATEMATSU RYO (JP)
ABE SHOTA (JP)
ABE SHOTA (JP)
Application Number:
PCT/JP2022/042338
Publication Date:
May 25, 2023
Filing Date:
November 15, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08L23/08; C08F4/6592; C08G18/08; C08L63/00; C08L75/04; C09D7/65; C09D123/08; C09D201/00
Domestic Patent References:
| WO2006126610A1 | 2006-11-30 |
Foreign References:
| JP2016041793A | 2016-03-31 | |||
| JPH1083097A | 1998-03-31 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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