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Title:
RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/124484
Kind Code:
A1
Abstract:
The present invention provides a resin composition and use thereof. The resin composition comprises a combination of resin and hollow glass microspheres, said hollow glass microspheres comprising the following components in percentage by mass: 89-93% of silicon dioxide, 5-10% of boron oxide, 0.3-1% of calcium oxide and 0.05-0.5% of sodium oxide. The hollow glass microspheres with specific components are compounded with the resin, so that the resin composition has low-dielectric-constant/low-dielectric-loss performance and good compressive strength, thereby meeting process requirements of glue mixing dispersion and lamination, and avoiding microsphere breakage risk. The resin composition and a metal foil-clad plate containing the resin composition have excellent low-dielectric-constant/low-dielectric-loss performance, and the temperature coefficient of dielectric constant is small, thus fully meeting the performance requirements of a high-frequency and high-speed substrate.

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Inventors:
CHEN GUANGBING (CN)
ZENG XIANPING (CN)
ZHANG XINGYE (CN)
Application Number:
PCT/CN2022/128034
Publication Date:
July 06, 2023
Filing Date:
October 27, 2022
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C03C3/06; C08L63/00
Foreign References:
JP2002087831A2002-03-27
CN112521720A2021-03-19
CN108585477A2018-09-28
CN112479595A2021-03-12
JP2008031409A2008-02-14
CN113277730A2021-08-20
CN105271784A2016-01-27
CN1153748A1997-07-09
Other References:
XU, YANCHAO ET AL.: "Dielectric Properties and Research Status of Oxide Glass", JOURNAL OF UNIVERSITY OF JINAN (SCIENCE AND TECHNOLOGY), vol. 21, no. 01, 25 April 0007 (0007-04-25), XP009547388, ISSN: 1671-3559
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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