Title:
RESIN COMPOSITION USED FOR FORMING RESIST PATTERN, AND SEMICONDUCTOR PRODUCT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/138034
Kind Code:
A1
Abstract:
Provided are: a resin composition that is used for forming a resist pattern and that enables formation of a resist pattern which can be easily and favorably released by use of a basic releasing solution even after contact with an oxidizing agent; and a semiconductor product manufacturing method that includes a step for forming a resist pattern by using the resin composition. This resin composition is used for forming the resist pattern and includes a binder resin as a binder, wherein a rosin ester resin is contained as the binder resin.
More Like This:
Inventors:
KANEMATSU MASANORI (JP)
TAMAI HITOSHI (JP)
TAMAI HITOSHI (JP)
Application Number:
PCT/JP2019/050511
Publication Date:
July 02, 2020
Filing Date:
December 24, 2019
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08K5/092; C08K3/013; C08K5/13; C08K5/18; C08K5/36; C08L71/02; C08L93/04
Foreign References:
| JPS59170165A | 1984-09-26 | |||
| JPH09104730A | 1997-04-22 | |||
| JP2009539252A | 2009-11-12 | |||
| JP2011039259A | 2011-02-24 | |||
| JP2012194521A | 2012-10-11 | |||
| JP2012194523A | 2012-10-11 | |||
| JPH06157875A | 1994-06-07 | |||
| JPH11209625A | 1999-08-03 | |||
| JP2007201482A | 2007-08-09 | |||
| JP2010043228A | 2010-02-25 | |||
| JP2018050005A | 2018-03-29 |
Attorney, Agent or Firm:
NIIYAMA Yuichi et al. (JP)
Download PDF: