Title:
RESIN COMPOSITION USED TO FORM RESIN LAYER OF METAL BASE SUBSTRATE, METAL BASE SUBSTRATE, AND METHOD FOR PRODUCING METAL BASE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/161902
Kind Code:
A1
Abstract:
Provided is a resin composition used in the formation of a resin layer of a metal base substrate which has a metal sheet, a metal foil, and the resin layer disposed between the metal sheet and the metal foil, wherein the resin composition comprises (A) bisphenol A-type phenoxy resin having a weight-average molecular weight of 4.0×104 to 4.9×104, (B) an inorganic filler, and (C) a silane coupling agent. When the silane coupling agent (C) content of the entire resin composition is c mass% and the inorganic filler (B) content of the entire resin composition is b mass%, the composition satisfies 5×10-2
Inventors:
BABA, Takayuki (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
馬場 孝幸 (〒02 東京都品川区東品川２丁目５番８号 住友ベークライト株式会社内 Tokyo, 〒1400002, JP)
馬場 孝幸 (〒02 東京都品川区東品川２丁目５番８号 住友ベークライト株式会社内 Tokyo, 〒1400002, JP)
Application Number:
JP2011/003402
Publication Date:
December 29, 2011
Filing Date:
June 15, 2011
Export Citation:
Assignee:
SUMITOMO BAKELITE CO., LTD. (5-8 Higashi-Shinagawa 2-chome, Shinagawa-ku Tokyo, 02, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
BABA, Takayuki (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
BABA, Takayuki (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
International Classes:
C08L71/10; B32B15/08; C08K3/00; C08K5/54; C08L63/00; H05K1/05
Attorney, Agent or Firm:
HAYAMI, Shinji (Gotanda TG Bldg. 9F, 9-2 Nishi-Gotanda 7-chome, Shinagawa-k, Tokyo 31, 〒1410031, JP)
Claims: