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Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2004/015007
Kind Code:
A1
Abstract:
A resin composition which has improved heat resistance and improved surface hardness while retaining the transparency (light-transmitting properties) inherent in an acrylic resin or polycarbonate and which is excellent in mechanical strength and moldability. The resin composition is obtained by incorporating up to 50 wt.% spherical inorganic oxide particles having an average particle diameter of 0.1 µm or smaller into an acrylic resin or polycarbonate.

Inventors:
YAMADA YASUHARU (JP)
OKU JUN-ICHI (JP)
UCHIYAMA HIROSHI (JP)
KAWAHASHI NORIO (JP)
IWATA TATSUO (JP)
Application Number:
PCT/JP2003/009779
Publication Date:
February 19, 2004
Filing Date:
August 01, 2003
Export Citation:
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Assignee:
TAMURA PLASTIC MFG CO LTD (JP)
INST NAGOYA IND SCIENCE RES (JP)
YAMADA YASUHARU (JP)
OKU JUN-ICHI (JP)
UCHIYAMA HIROSHI (JP)
KAWAHASHI NORIO (JP)
IWATA TATSUO (JP)
International Classes:
C08K3/22; C08K7/00; (IPC1-7): C08L33/00; C08K3/00; C08L69/00
Domestic Patent References:
WO2000034389A12000-06-15
Foreign References:
JP2003231816A2003-08-19
JP2003155355A2003-05-27
JP2003147090A2003-05-21
JP2003082238A2003-03-19
JP2003096210A2003-04-03
JP2003073564A2003-03-12
JP2003073563A2003-03-12
JP2002192596A2002-07-10
JP2002047425A2002-02-12
JP2001164133A2001-06-19
JP2001019779A2001-01-23
JPH09255879A1997-09-30
Attorney, Agent or Firm:
Konishi, Tomimasa (17-12 Marunouchi 2-chome, Naka-k, Nagoya-shi Aichi, JP)
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