RESIN COMPOSITION - KYOWA HAKKO CHEMICAL CO LTD

Title:

RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2005/040282

Kind Code:

A1

Abstract:

Disclosed is a resin composition or the like containing a thermoplastic resin and a polymer having a structural unit represented by the general formula (I) below in a molecule. (I) (In the formula, n represents an integer of 2-1000; R¹ represents a substituted or unsubstituted lower alkyl, a substituted or unsubstituted cycloalkyl, a substituted or unsubstituted aryl or a substituted or unsubstituted aralkyl; R², R³, R⁴ and R⁵ may be the same or different and respectively represent a hydrogen atom, a substituted or unsubstituted lower alkyl, a substituted or unsubstituted cycloalkyl, a substituted or unsubstituted aryl or a substituted or unsubstituted aralkyl. In this connection, two or more R¹, R², R³ and R⁴ may be the same or different from each other respectively.)

Inventors:

KODAMA SAI
INAYAMA TOSHIHIRO
MURATA SHIGERU

Application Number:

PCT/JP2004/016350

Publication Date:

May 06, 2005

Filing Date:

October 28, 2004

Export Citation:

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Assignee:

KYOWA HAKKO CHEMICAL CO LTD (JP)
KODAMA SAI
INAYAMA TOSHIHIRO
MURATA SHIGERU

International Classes:

C08G18/66; C08L67/04; C08L67/00; C08L75/04; (IPC1-7): C08L101/00; C08F16/12; C08G18/00; C08G63/00; C08G65/00

Foreign References:

JP2003292768A	2003-10-15
JPH11147924A	1999-06-02
JPH08217820A	1996-08-27
JPH06239944A	1994-08-30

Attorney, Agent or Firm:

Iwahashi, Kazuyuki (Intellectual Property Department, 6-1, Ohtemachi 1-chom, Chiyoda-ku Tokyo 85, JP)

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