Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2010/082658
Kind Code:
A1
Abstract:
Disclosed is a resin composition which can be cured into a product having a low dielectric tangent and excellent adhesion strength to a conductor. The resin composition comprises a specific cyanate ester resin, a curable polyvinyl benzyl compound and a metal-based curing catalyst.
Inventors:
NAKAMURA SHIGEO (JP)
YAMAMOTO YUKI (JP)
OHASHI SEIICHIRO (JP)
YAMAMOTO YUKI (JP)
OHASHI SEIICHIRO (JP)
Application Number:
PCT/JP2010/050531
Publication Date:
July 22, 2010
Filing Date:
January 19, 2010
Export Citation:
Assignee:
AJINOMOTO KK (JP)
NAKAMURA SHIGEO (JP)
YAMAMOTO YUKI (JP)
OHASHI SEIICHIRO (JP)
NAKAMURA SHIGEO (JP)
YAMAMOTO YUKI (JP)
OHASHI SEIICHIRO (JP)
International Classes:
C08J5/24; C08G73/00; C08K3/36; C08K5/315; C08L65/00; C08L71/08; C08L101/00; C09J7/35; C09J11/06; C09J165/00; C09J179/04; H05K1/03; H05K3/46
Domestic Patent References:
| WO2008044766A1 | 2008-04-17 |
Foreign References:
| JPH01503783A | 1989-12-21 | |||
| JP2005244150A | 2005-09-08 | |||
| JPH0528828A | 1993-02-05 |
Attorney, Agent or Firm:
TAKASHIMA, HAJIME (JP)
Takashima 1 (JP)
Takashima 1 (JP)
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