Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/046810
Kind Code:
A1
Abstract:
In response to the problem of providing a resin composition having good transparency, pencil hardness, and adhesiveness, the present invention provides a resin composition comprising (D) a urethane acrylate obtained by reacting (A) a (meth)acrylic acid ester monomer having hydroxyl groups, (B) a photopolymerization initiator having hydroxyl groups, and (C) an isocyanate having isocyanate groups; (E) a polymerizable (meth)acrylate; and (F) a silane coupling agent. This resin composition is used as an adhesive or hard coating agent, and further, is ideal for the production of a touch panel laminate or liquid crystal panel laminate.
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Inventors:
HISHA,Yuki (Shibukawa Plant Electronic Materials Research Dept.1135,Nakamura,Shibukawa-cit, Gunma 20, 〒3778520, JP)
比舎 佑基 (〒20 群馬県渋川市中村１１３５番地 電気化学工業株式会社 渋川工場 電子材料研究部内 Gunma, 〒3778520, JP)
比舎 佑基 (〒20 群馬県渋川市中村１１３５番地 電気化学工業株式会社 渋川工場 電子材料研究部内 Gunma, 〒3778520, JP)
Application Number:
JP2011/073113
Publication Date:
April 12, 2012
Filing Date:
October 06, 2011
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA (1-1Nihonbashi-Muromachi 2-chome, Chuo-ku Tokyo, 38, 〒1038338, JP)
電気化学工業株式会社 (〒38 東京都中央区日本橋室町ニ丁目１番１号 Tokyo, 〒1038338, JP)
HISHA,Yuki (Shibukawa Plant Electronic Materials Research Dept.1135,Nakamura,Shibukawa-cit, Gunma 20, 〒3778520, JP)
電気化学工業株式会社 (〒38 東京都中央区日本橋室町ニ丁目１番１号 Tokyo, 〒1038338, JP)
HISHA,Yuki (Shibukawa Plant Electronic Materials Research Dept.1135,Nakamura,Shibukawa-cit, Gunma 20, 〒3778520, JP)
International Classes:
C08F290/06; B32B27/30; C08G18/67; C09D4/02; C09J4/02
Attorney, Agent or Firm:
AXIS Patent International (Yushi Kogyo Kaikan, 13-11Nihonbashi 3-chome,Chuo-k, Tokyo 27, 〒1030027, JP)
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Claims:
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