Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/056478
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition that exhibits excellent normal-state adhesiveness and peelability. The present invention provides a resin composition that is characterized by comprising: a moisture-curable hot melt urethane composition (1) that contains a urethane prepolymer (a-1) comprising an isocyanate group; and a UV-curable adhesive composition (2) that contains a urethane (meth)acrylate (b-1), a (meth)acrylic monomer (b-2), and a photopolymerization initiator (b-3). The present invention also provides a product that is characterized by at least two substrates being bonded together by the resin composition. The present invention also provides a production method for an article that is characterized by being obtained by: applying the resin composition on a substrate; subsequently curing the UV-curable adhesive composition (2) by irradiating with UV rays; subsequently bonding a substrate onto the applied layer; and subsequently using moisture to cure the moisture-curable hot melt urethane composition (1).
Inventors:
KANAGAWA YOSHINORI (JP)
OOHATA RYOUHEI (JP)
OOJI YASUO (JP)
TSUNASHIMA KEIJI (JP)
OOHATA RYOUHEI (JP)
OOJI YASUO (JP)
TSUNASHIMA KEIJI (JP)
Application Number:
PCT/JP2014/070561
Publication Date:
April 23, 2015
Filing Date:
August 05, 2014
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C09J175/04; C09J4/00
Domestic Patent References:
| WO2011096111A1 | 2011-08-11 | |||
| WO2012163593A1 | 2012-12-06 |
Foreign References:
| JP2004182886A | 2004-07-02 | |||
| JP2012067303A | 2012-04-05 |
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
Michihiro Kono (JP)
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