Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/111635
Kind Code:
A1
Abstract:
Provided is a resin composition capable of suppressing deterioration of an organic EL device. The resin composition contains (A) an alicyclic epoxy compound, (B) a bisphenol A type epoxy resin, (C) a bisphenol F type epoxy resin and (D) a photocation polymerization initiator. Moreover, the bisphenol A type epoxy resin (B) and the bisphenol F type epoxy resin (C) are compounds that do not contain the alicyclic epoxy compound (A) and have a moisture content of 1000 ppm or lower. In addition, the resin composition may further contain (H) a filler, with the moisture content therein being 50 ppm or higher.
Inventors:
HOSHINO TAKAKO (JP)
HISHA YUKI (JP)
GOTO YOSHITSUGU (JP)
HISHA YUKI (JP)
GOTO YOSHITSUGU (JP)
Application Number:
PCT/JP2015/051575
Publication Date:
July 30, 2015
Filing Date:
January 21, 2015
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
International Classes:
C08L63/00; C08G59/68; C08K5/06; C08K5/54; C09J11/06; C09J163/02; C09K3/10; H01L51/50; H05B33/04; H05B33/10
Domestic Patent References:
| WO2015029689A1 | 2015-03-05 | |||
| WO2014017524A1 | 2014-01-30 |
Foreign References:
| JP2013023574A | 2013-02-04 | |||
| JP2012136614A | 2012-07-19 | |||
| JP2005302401A | 2005-10-27 | |||
| JP2013186976A | 2013-09-19 | |||
| JP2007254743A | 2007-10-04 | |||
| JP2010126699A | 2010-06-10 | |||
| JP2012082297A | 2012-04-26 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
SK patent business corporation (JP)
SK patent business corporation (JP)
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