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Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/178474
Kind Code:
A1
Abstract:
Provided are: a resin composition having favorable transparency, moisture permeation resistance, heat resistance, and moist heat resistance; and a resin composition sheet obtained by means of same. The resin composition contains a polyisobutylene resin, a modified polyolefin resin, a tackifying resin, and a polystyrene-polyolefin block copolymer. The resin composition sheet results from forming a resin composition layer from the resin composition on a support body.

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Inventors:
TAKAHASHI CHIHIRO (JP)
AKUTA KENJI (JP)
TAKAHASHI SYOUSHI (JP)
HOZUMI YASUHIRO (JP)
HAKONE YOSHIHIRO (JP)
Application Number:
PCT/JP2015/064709
Publication Date:
November 26, 2015
Filing Date:
May 22, 2015
Export Citation:
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Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08L23/22; C08J5/18; C08K5/42; C08L23/26; C08L53/00; C08L57/02; C09K3/10
Domestic Patent References:
WO2011062167A12011-05-26
Foreign References:
JP2012219191A2012-11-12
JP2010007035A2010-01-14
JP2006335997A2006-12-14
JPH0827314A1996-01-30
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, p. c. (JP)
Patent business corporation Asamura patent firm (JP)
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