Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/052664
Kind Code:
A1
Abstract:
The resin composition according to the present invention can maintain a reasonable pot life and maintain the conductivity of a filler. The resin composition according to the present invention has excellent adhesive strength. The resin composition according to the present invention can suppress peeling of a hardened material during a high-temperature process. The resin composition according to the present invention is suitable for use as a die-attach paste or an adhesive for a heat radiation member. The resin composition comprises: (A) a filler having a conductive material on the surface of an insulating core material; (B) a thermosetting resin; (C) a curing agent; and (D) a thioether compound. The present invention relates to an adhesive for a heat radiation member or a die-attach paste, the adhesive comprising the resin composition. The present invention relates to a semiconductor device manufactured using the adhesive for a heat radiation member or die-attach paste.
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Inventors:
MIZUMURA NORITSUKA (JP)
FUKAZAWA KAZUKI (JP)
FUKAZAWA KAZUKI (JP)
Application Number:
PCT/JP2015/077852
Publication Date:
April 07, 2016
Filing Date:
September 30, 2015
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L101/00; C08K5/098; C08K5/372; C08K9/02; C09J201/00; H01B1/22; H01L21/52; H01L23/36
Domestic Patent References:
| WO2014157175A1 | 2014-10-02 |
Foreign References:
| JP2001338529A | 2001-12-07 | |||
| JP2009263499A | 2009-11-12 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Patent business corporation Tsukuni (JP)
Patent business corporation Tsukuni (JP)
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