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Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/125664
Kind Code:
A1
Abstract:
Provided is a resin composition which gives cured objects that exhibit sufficient heat-diffusing properties and have a satisfactory strength of adhesion to metal layers. The resin composition comprises (A) an epoxy resin, (B) a hardener, and (C) inorganic fillers, wherein the component (B) comprises a liquid phenolic hardener and the component (C) comprises an inorganic filler (C1) having an average particle diameter of 0.1 µm or larger but smaller than 3 µm, an inorganic filler (C2) having an average particle diameter of 3 µm or larger but smaller than 10 µm, and an inorganic filler (C3) having an average particle diameter of 10-35 µm.

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Inventors:
HOMMA TATSUYA (JP)
OKUYAMA HANAE (JP)
Application Number:
PCT/JP2016/052394
Publication Date:
August 11, 2016
Filing Date:
January 27, 2016
Export Citation:
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Assignee:
AJINOMOTO KK (JP)
International Classes:
C08L63/00; B32B27/20; C08K3/28; C08K3/34; H01L23/14; H01L23/36; H01L23/40; H05K1/03
Foreign References:
JP2012077123A2012-04-19
JP2012077098A2012-04-19
JP2008156383A2008-07-10
JP2013053278A2013-03-21
JP2006176549A2006-07-06
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Patent business corporation Sakai international patent firm (JP)
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