Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/204165
Kind Code:
A1
Abstract:
The present invention provides a resin composition which can be used to obtain a cured film having chemical resistance, low stress properties, and high stretchability even in a low-temperature heating process. (a) The resin composition contains an alkali-soluble resin which contains a phenol backbone having a crosslinkable group and a phenol backbone not having a crosslinkable group, and has a weight-average molecular weight within the range of 1,000-50,000, and is characterized in that the content ratio of the phenol backbone having a crosslinkable group to a total of 100 mol% of the phenol backbone having a crosslinkable group and the phenol backbone not having a crosslinkable group, is within the range of 5-90 mol%.
Inventors:
MASUDA YUKI (JP)
OKUDA RYOJI (JP)
OKUDA RYOJI (JP)
Application Number:
PCT/JP2017/019065
Publication Date:
November 30, 2017
Filing Date:
May 22, 2017
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L61/14; C08L79/08; G03F7/004; G03F7/023
Domestic Patent References:
| WO2012098734A1 | 2012-07-26 |
Foreign References:
| JP2012063498A | 2012-03-29 | |||
| JP2012162642A | 2012-08-30 | |||
| JPH0743902A | 1995-02-14 | |||
| JP2012252273A | 2012-12-20 |
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