Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/212816
Kind Code:
A1
Abstract:
This resin composition includes a resin selected from the group consisting of polyamide, polylactic acid, and polyphenylene sulfide and having a melting point of 170-370°C as component (A), a triazine compound represented by general formula (1) as component (B), a specific oxidant as component (C), and a specific light stabilizer as component (D) and includes 0.05-5.0 parts by mass of component (B), 0-3.0 parts by mass of component (C), and 0-1.0 part by mass of component (D) per 100 parts by mass of component (A). The details of component (B), component (C), and component (D) are as described in the specification.
Inventors:
AKATSU HIROKI (JP)
AYABE TAKASHI (JP)
AYABE TAKASHI (JP)
Application Number:
PCT/JP2017/016657
Publication Date:
December 14, 2017
Filing Date:
April 27, 2017
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C08L77/00; B29C45/00; C08K5/3492; C08L67/04; C08L81/02; C08L101/16
Domestic Patent References:
| WO2002081559A1 | 2002-10-17 | |||
| WO2016093108A1 | 2016-06-16 |
Foreign References:
| JPH1017337A | 1998-01-20 | |||
| JPH04154772A | 1992-05-27 | |||
| JP2002114879A | 2002-04-16 | |||
| JPH08225679A | 1996-09-03 | |||
| JPH1017557A | 1998-01-20 |
Other References:
See also references of EP 3470465A4
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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