Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/079516
Kind Code:
A1
Abstract:
Conventional resins for hot-melt shaping devices have only insufficient heat resistance and strength, which restricts uses and places of use thereof. The present invention solves the problem of the insufficient heat resistance and strength occurring in thermoplastic resin materials for hot-melt shaping devices by using a thermoplastic resin having hydroxyl and a thermoplastic resin having ester bonds and introducing crosslinking thereinto via an ester exchange reaction.
Inventors:
KAJIHARA YURI (JP)
TADA YASUHIKO (JP)
MURAKI TAKAHITO (JP)
TADA YASUHIKO (JP)
MURAKI TAKAHITO (JP)
Application Number:
PCT/JP2017/038266
Publication Date:
May 03, 2018
Filing Date:
October 24, 2017
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
C08L101/06; B29C67/00; B33Y10/00; B33Y70/00; B33Y80/00; C08J3/20
Domestic Patent References:
WO2015098776A1 | 2015-07-02 |
Foreign References:
JP2003261734A | 2003-09-19 | |||
JP2007100108A | 2007-04-19 | |||
JP2008031439A | 2008-02-14 |
Attorney, Agent or Firm:
TODA Yuji (JP)
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