Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/173920
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition which enables the achievement of a cured film that has a low dielectric loss tangent and is capable of withstanding a heat treatment and a chemical treatment, said treatments being associated with the formation of a coil pattern. In order to achieve the above-described purpose, the configuration of the present invention is as follows. A resin composition which contains (P) a resin that has an alicyclic structure and an aromatic ring structure, and wherein the resin (P) that has an alicyclic structure and an aromatic ring structure has a group having two or more alicyclic rings and a group wherein two or more benzene rings are bonded by means of a single bond.

Inventors:
KIUCHI, Yohei (Toray Industries Inc., 1-1, Sonoyama 1-chome, Otsu-sh, Shiga 58, 〒5208558, JP)
OKUDA, Ryoji (Toray Industries Inc., 1-1, Sonoyama 1-chome, Otsu-sh, Shiga 58, 〒5208558, JP)
Application Number:
JP2018/010245
Publication Date:
September 27, 2018
Filing Date:
March 15, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TORAY INDUSTRIES, INC. (1-1 Nihonbashi-Muromachi 2-chome, Chuo-ku Tokyo, 66, 〒1038666, JP)
International Classes:
C08L101/00; C08G73/10; C08L79/08; H01B3/30; H01B17/56
Foreign References:
JP2005320393A2005-11-17
JPH01132632A1989-05-25
JPH0241319A1990-02-09
JP2015134842A2015-07-27
JP2018053156A2018-04-05
Download PDF: