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Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/194099
Kind Code:
A1
Abstract:
This resin composition contains: (A) a thermosetting resin; (B) a curing agent; (C) a thermoplastic resin; and (D) a magnetic filler, wherein the modulus of elasticity of a cured product at 23°C is 7-18 GPa, the cured product being obtained by thermally curing the resin composition.

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Inventors:
OOYAMA HIDEKI (JP)
MATSUMURA ERI (JP)
HAYASHI EIICHI (JP)
Application Number:
PCT/JP2018/016029
Publication Date:
October 25, 2018
Filing Date:
April 18, 2018
Export Citation:
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Assignee:
AJINOMOTO KK (JP)
International Classes:
C08L63/00; C08G59/20; C08K3/00; C09J7/35; C09J11/04; C09J129/14; C09J133/00; C09J163/00; C09J201/00; H01F17/00; H05K1/03; H05K1/16
Foreign References:
JP2015187260A2015-10-29
JP2016172790A2016-09-29
JPS62222425A1987-09-30
JP2002363382A2002-12-18
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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