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Patent Searching and Data


Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/212330
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition that can be cured at a temperature of as low as 80 degrees or less, preferably at room temperature, that has fewer components that volatilize during use (application) or during curing, and that is preferably used as a one-part adhesive in production of an image sensor module or an electronic part. The resin composition according to the present invention contains one or more 2-methylene 1,3-dicarbonyl compounds. At least one of the one or more 2-methylene 1,3-dicarbonyl compounds has a molecular weight of 220-10,000. The weight proportion of 2-methylene 1,3-dicarbonyl compounds having a molecular weight of less than 220 is 0.00-0.05, when the weight of the entire resin composition is defined as 1. In addition, the 2-methylene 1,3-dicarbonylcompounds contain a structural unit represented by formula (I).

Inventors:
ARAI FUMINORI (JP)
IWAYA KAZUKI (JP)
Application Number:
PCT/JP2018/019312
Publication Date:
November 22, 2018
Filing Date:
May 18, 2018
Export Citation:
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Assignee:
NAMICS CORP (JP)
International Classes:
C08F20/12; C08G65/00; C08J5/18; C08J5/24; C09J11/00; C09J133/00; C09J135/00; H01L23/10; H05K1/03
Domestic Patent References:
WO2014078689A12014-05-22
WO2012054616A22012-04-26
WO2012054633A22012-04-26
WO2016040261A12016-03-17
Foreign References:
JP2015517973A2015-06-25
JP2017036361A2017-02-16
JP2015512460A2015-04-27
US9617377B12017-04-11
US9567475B12017-02-14
JP2016506072A2016-02-25
JP2015518503A2015-07-02
JP2010117545A2010-05-27
JP2008184514A2008-08-14
JP2017098918A2017-06-01
Other References:
See also references of EP 3626751A4
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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