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Patent Searching and Data


Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/168107
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition which serves as a raw material of a primer capable of forming a coating film that has excellent solution stability and adhesion to a nonpolar substrate and that also has excellent chipping resistance. Provided is a resin composition containing: a component A that is a modified polyolefin resin; and a component B that is a polymer having a functional group at least at a terminal thereof, having a number-average molecular weight of 1,000-20,000, and containing a structural unit (i) derived from a (meth)acrylic ester represented by general formula (1). (1): CH2=C(R1)COOR2 (In general formula (1), R1 represents a hydrogen atom or a methyl group; R2 represents a group represented by -CnH2n+1; and n represents an integer of 1 to 18.)

Inventors:
KONO MASARU (JP)
ABE HITOMI (JP)
HAYAKAWA JUNICHI (JP)
YADA MINORU (JP)
KOMOTO NAOSUKE (JP)
Application Number:
PCT/JP2019/007854
Publication Date:
September 06, 2019
Filing Date:
February 28, 2019
Export Citation:
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Assignee:
JUJO PAPER CO LTD (JP)
International Classes:
C08L23/26; C08L33/06; C09D5/00; C09D123/00; C09D123/28; C09D133/06
Foreign References:
JP2007291282A2007-11-08
JP2005281519A2005-10-13
JPS5744645A1982-03-13
JP2001002977A2001-01-09
JP2007182527A2007-07-19
JPH10298490A1998-11-10
JPH06336568A1994-12-06
JPH07304913A1995-11-21
JP2016538370A2016-12-08
JPS60123565A1985-07-02
JPH05239292A1993-09-17
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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