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Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/194107
Kind Code:
A1
Abstract:
Provided is a novel resin composition having excellent heat resistance, and which is suitable for use as a material for insulating films in electronic components and the like. The resin composition contains: a compound (a) represented by formula (1); a resin (b) having a hydrogen-bonding group; and a polymerization initiator (c). (In formula (1), A is a divalent organic group, Y is a C1-18 straight-chain alkylene or branched alkylene, if said alkylene has 2 or more carbon atoms an oxygen atom (-O-) may be inserted into an arbitrarily-defined C-C bond, -CO- may be inserted into a terminal C-N bond, m is 0 or 1, and X is a group represented by formula (2).) (In formula (2), R1 and R2 are independently hydrogen or methyl.)

Inventors:
YOHDA, Masaaki (ICHIHARA RESEARCH CENTER 5-1, Goikaigan, Ichihara-sh, Chiba 51, 〒2908551, JP)
YASUI, Ping (ICHIHARA RESEARCH CENTER 5-1, Goikaigan, Ichihara-sh, Chiba 51, 〒2908551, JP)
OIKAWA, Hisao (ICHIHARA RESEARCH CENTER 5-1, Goikaigan, Ichihara-sh, Chiba 51, 〒2908551, JP)
YAMAHIRO, Mikio (2-1 Otemachi 2-chome, Chiyoda-k, Tokyo 05, 〒1008105, JP)
Application Number:
JP2019/014293
Publication Date:
October 10, 2019
Filing Date:
March 29, 2019
Export Citation:
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Assignee:
JNC CORPORATION (2-1 Otemachi 2-chome, Chiyoda-ku Tokyo, 05, 〒1008105, JP)
International Classes:
C08F20/36; C07F7/10; C08F299/06; C08L83/04; C09D4/02; C09D175/02; C09D183/04
Domestic Patent References:
WO2017150039A12017-09-08
WO2018235549A12018-12-27
Foreign References:
JP2007055993A2007-03-08
JP2010189294A2010-09-02
JP2007169375A2007-07-05
JP2012009796A2012-01-12
JP2008088251A2008-04-17
JP2011079926A2011-04-21
Attorney, Agent or Firm:
OKUBO, Katsuyuki (7th Floor, SEIBUNDO Building 4-3-26, Kudan-kita, Chiyoda-k, Tokyo 73, 〒1020073, JP)
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