Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/071526
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition which can be produced stably with reduced variations in properties, can be improved in productivity, and is suitable as a one-pack adhesive agent that can be used in the manufacture of an electronic component. The resin composition according to the present invention contains an anionic polymerization inhibitor comprising (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) an initiator comprising at least one basic substance and (c) at least one boric acid ester compound.
Inventors:
SATO AYAKO (JP)
ARAI FUMINORI (JP)
ARAI FUMINORI (JP)
Application Number:
PCT/JP2019/039261
Publication Date:
April 09, 2020
Filing Date:
October 04, 2019
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08F22/14; C08L35/02; C09J4/00; C09J11/06
Domestic Patent References:
| WO2012054616A2 | 2012-04-26 | |||
| WO2012054633A2 | 2012-04-26 | |||
| WO2016040261A1 | 2016-03-17 |
Foreign References:
| JP2015519416A | 2015-07-09 | |||
| JP2017526791A | 2017-09-14 | |||
| JP2007177014A | 2007-07-12 | |||
| JPS5331740A | 1978-03-25 | |||
| JP2017527667A | 2017-09-21 | |||
| JP2018517809A | 2018-07-05 | |||
| JP2015518503A | 2015-07-02 | |||
| JP2010117545A | 2010-05-27 | |||
| JP2008184514A | 2008-08-14 |
Other References:
See also references of EP 3865519A4
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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