Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/063266
Kind Code:
A1
Abstract:
A resin composition comprising a biphenyl aralkyl-type phenol resin (A), an epoxy resin (B), an active ester compound (C), and an inorganic filler (D), wherein the amount of the active ester compound (C) is not less than 10 mass% with respect to 100 mass% of nonvolatile components in the resin composition, and the amount of the inorganic filler (D) is not less than 60 mass% with respect to 100 mass% of nonvolatile components in the resin composition, or is not less than 45 vol.% with respect to 100 vol.% of nonvolatile components in the resin composition.
Inventors:
NISHIMURA YOSHIO (JP)
NAGAOKA JIROU (JP)
NAGAOKA JIROU (JP)
Application Number:
PCT/JP2022/037690
Publication Date:
April 20, 2023
Filing Date:
October 07, 2022
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
C08L63/00; B32B15/08; C08G59/42; C08G59/62; C08K3/013; C08L101/00; H05K1/03
Foreign References:
| JP2018172519A | 2018-11-08 | |||
| JP2021014545A | 2021-02-12 | |||
| JP2020083898A | 2020-06-04 | |||
| JP2021134300A | 2021-09-13 | |||
| JP2020152825A | 2020-09-24 | |||
| JP2021116331A | 2021-08-10 | |||
| JP2021161205A | 2021-10-11 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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