RESIN COMPOSITION - SEKISUI CHEMICAL CO LTD

Title:

RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2024/071119

Kind Code:

A1

Abstract:

Provided is a resin composition containing a thermoplastic resin that is solid at normal temperature and fluid at 160°C, the resin composition having a viscosity at 1 rpm at 160°C of 250,000 mPa∙s or greater. Also provided is a resin composition containing a thermoplastic resin that is solid at normal temperature and fluid at 160°C, the resin composition furthermore containing a reactive component.

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Inventors:

MIYATA SHINGO (JP)
KINOSHITA MASAMI (JP)
IKEUCHI TAKUTO (JP)
ISHII YASUYUKI (JP)

Application Number:

PCT/JP2023/034944

Publication Date:

April 04, 2024

Filing Date:

September 26, 2023

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)
SEKISUI FULLER CO LTD (JP)

International Classes:

C08L101/12; C08K3/01; C08L91/06; E04B1/94

Attorney, Agent or Firm:

TAGUCHI, Masahiro et al. (JP)

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