Title:
RESIN CONTAINING PHENOLIC HYDROXYL GROUP, RESIN COMPOSITION FOR ALKALI-DEVELOPABLE RESISTS, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING RESIN CONTAINING PHENOLIC HYDROXYL GROUP
Document Type and Number:
WIPO Patent Application WO/2022/065041
Kind Code:
A1
Abstract:
Provided is a resin containing a phenolic hydroxyl group, which has satisfactory solubility in an organic solvent, has a low viscosity and low polarity and thereby has an excellent property to penetrate into microspaces, and can be used for the formation of an ultra-miniaturized wiring pattern. More specifically provided is a resin containing a phenolic hydroxyl group, which is characterized by comprising at least one compound (1) containing a phenolic hydroxyl group which is selected from the group consisting of a compound represented by structural formula (1) and a compound represented by structural formula (1').
Inventors:
IMADA TOMOYUKI (JP)
NAGAE NORIO (JP)
NAGAE NORIO (JP)
Application Number:
PCT/JP2021/033079
Publication Date:
March 31, 2022
Filing Date:
September 09, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G8/20; C07C49/747; C07C49/755; G03F7/11
Domestic Patent References:
| WO2015008560A1 | 2015-01-22 |
Foreign References:
| JP2010202750A | 2010-09-16 | |||
| JP2010230773A | 2010-10-14 | |||
| JP2010235643A | 2010-10-21 | |||
| JP2011016891A | 2011-01-27 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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