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Patent Searching and Data


Title:
RESIN-CONTAINING SHEET, AND STRUCTURE AND WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/072334
Kind Code:
A1
Abstract:
Provided are a resin-containing sheet whereby bending resistance of a substrate is enhanced while chemical strength of a cellulose nanofiber nonwoven fabric is enhanced, and a structure and wiring board which use the same. A resin-containing sheet having a specific cellulose nanofiber nonwoven fabric (11), a fixing agent (2) for fixing together fibers (1) in the cellulose nanofiber nonwoven fabric (11), and a resin (3) in contact with the cellulose nanofiber nonwoven fabric (11) and the fixing agent (2), the storage modulus of the fixing agent (2) being higher than the storage modulus of the resin (3). A structure obtained by bonding the resin-containing sheet to a substrate. A wiring board having the structure.

Inventors:
KAKUTANI TAKENORI (JP)
MIWA TAKAO (JP)
ONO HIROFUMI (JP)
SAITO YAMATO (JP)
Application Number:
PCT/JP2015/080448
Publication Date:
May 12, 2016
Filing Date:
October 28, 2015
Export Citation:
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Assignee:
TAIYO HOLDINGS CO LTD (JP)
ASAHI CHEMICAL IND (JP)
International Classes:
C08J5/24; B32B5/28; C08J5/06; D21H15/02; H05K1/03
Domestic Patent References:
WO2014175315A12014-10-30
WO2013022025A12013-02-14
WO2012090908A12012-07-05
Foreign References:
JP2012036529A2012-02-23
JPH09307203A1997-11-28
JPH1037054A1998-02-10
JP2008127540A2008-06-05
JP2006316253A2006-11-24
JP2006035647A2006-02-09
JP2009096167A2009-05-07
Other References:
See also references of EP 3216823A4
Attorney, Agent or Firm:
HONDA ICHIRO (JP)
Ichiro Honda (JP)
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