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Patent Searching and Data


Title:
RESIN-COVERED CONDUCTOR, COIL, AND MANUFACTURING METHOD FOR RESIN-COVERED CONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2024/009909
Kind Code:
A1
Abstract:
Provided is a resin-covered conductor that comprises a conductor and a covering material that contains a resin and covers the conductor. The surface of the covering material is irradiated with an electron beam. The temperature of electron beam irradiation is less than a melting point of the resin forming the covering material. The electron beam acceleration voltage of the electron beam irradiation is 500 kV or lower.

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Inventors:
IMAMURA HITOSHI (JP)
WADA HIROAKI (JP)
FUJISAWA MANABU (JP)
SUKEGAWA MASAMICHI (JP)
Application Number:
PCT/JP2023/024432
Publication Date:
January 11, 2024
Filing Date:
June 30, 2023
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
International Classes:
H01B7/02; H01B13/14; H01F5/06; H02K3/38
Foreign References:
JP6756413B12020-09-16
JP2014093256A2014-05-19
JP2015149274A2015-08-20
JP4792622B22011-10-12
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
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