Title:
RESIN CURED PRODUCT, RESIN COMPOSITION, RESIN SUBSTRATE, LAYERED SUBSTRATE, AND RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2022/210431
Kind Code:
A1
Abstract:
A resin cured product (22) has a group with a specific structure, and when heated to 590°C, generates thermal decomposition products including xylene, methylbenzoquinone, methylbenzaldehyde, methylhydroquinone, and a specific substance.
Inventors:
ITO HIROSHI (JP)
INAGAKI TAKASHI (JP)
SATO AYANO (JP)
INAGAKI TAKASHI (JP)
SATO AYANO (JP)
Application Number:
PCT/JP2022/014697
Publication Date:
October 06, 2022
Filing Date:
March 25, 2022
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
C08G59/62; B32B27/00; B32B27/38
Domestic Patent References:
| WO2020203449A1 | 2020-10-08 | |||
| WO2021193952A1 | 2021-09-30 |
Foreign References:
| JPS6257461A | 1987-03-13 | |||
| JPH11323162A | 1999-11-26 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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