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Title:
RESIN CURING AGENT, CURABLE RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC DEVICE, LAMINATE SHEET MATERIAL, ELECTRONIC COMPONENT SEALING MATERIAL, ESTER COMPOUND, METHOD FOR PRODUCING ESTER COMPOUND, AND METHOD FOR PRODUCING NOVOLAC RESIN
Document Type and Number:
WIPO Patent Application WO/2023/080072
Kind Code:
A1
Abstract:
This resin curing agent comprises at least one compound selected from the group consisting of: an ester compound which includes, in a molecular structure, a partial structure represented by -C(CF3)H-, and at least two aromatic ester partial structures, includes, at the end of a molecule, at least one or two partial structures selected from the group consisting of an aryloxycarbonyl structure, an arylcarbonyloxy structure, and a hydroxyaryl structure, and includes a specific partial structure; and a novolak resin including a specific partial structure.

Inventors:
HIROTAKI KENSUKE (JP)
SEKI KEIJIRO (JP)
NAGURA HIROKATSU (JP)
HOSOI KENJI (JP)
Application Number:
PCT/JP2022/040363
Publication Date:
May 11, 2023
Filing Date:
October 28, 2022
Export Citation:
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Assignee:
CENTRAL GLASS CO LTD (JP)
International Classes:
C08G59/40; C07C67/14; C07C69/78; C07C69/83; C08G8/04; C08G8/28
Domestic Patent References:
WO2021193878A12021-09-30
WO2021172319A12021-09-02
Foreign References:
JP2021059738A2021-04-15
JP2013159638A2013-08-19
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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