Title:
RESIN DOUBLE LAYER-ATTACHED COPPER FOIL, MULTILAYER PRINTED CIRCUIT BOARD INCLUDING SAME, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2015/102461
Kind Code:
A1
Abstract:
The present invention provides a resin double layer-attached copper foil, a multilayer printed circuit board including the resin double layer-attached copper foil, and a manufacturing method thereof, the copper foil comprising: (a) a copper foil having predetermined surface roughness formed on one side thereof; (b) a first insulation resin layer formed on a rough surface of the copper foil; and (c) a non-fiber substrate type second insulation resin layer which is formed on one side of the first insulation resin layer, and which contains an inorganic filler and a resin. The present invention can provide a buildup printed circuit board capable of implementing a high-density microcircuit pattern by reducing the entire stacking thickness and also lowering an interlayer coefficient of thermal expansion of a substrate.
Inventors:
NOH WOO HYUN (KR)
HAN SEUNG JIN (KR)
CHO KYEONG WOON (KR)
NA JEA IK (KR)
KIM YONG HYUN (KR)
KOH CHANG HOON (KR)
HAN SEUNG JIN (KR)
CHO KYEONG WOON (KR)
NA JEA IK (KR)
KIM YONG HYUN (KR)
KOH CHANG HOON (KR)
Application Number:
PCT/KR2015/000089
Publication Date:
July 09, 2015
Filing Date:
January 06, 2015
Export Citation:
Assignee:
DOOSAN CORP (KR)
International Classes:
B32B15/08; B32B15/088; H05K1/03; H05K3/28
Foreign References:
| KR20100100930A | 2010-09-15 | |||
| JP2013077590A | 2013-04-25 | |||
| KR20090100388A | 2009-09-23 | |||
| KR20100086786A | 2010-08-02 |
Attorney, Agent or Firm:
HANBEOT PATENT & LAW FIRM (KR)
특허법인 한벗 (KR)
특허법인 한벗 (KR)
Download PDF:
Previous Patent: WHEELCHAIR
Next Patent: SINGLE BIT STREAM GENERATING METHOD AND GENERATING DEVICE FOR MULTIPLE IMAGES
Next Patent: SINGLE BIT STREAM GENERATING METHOD AND GENERATING DEVICE FOR MULTIPLE IMAGES