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Patent Searching and Data


Title:
RESIN EMULSION FOR SEALER
Document Type and Number:
WIPO Patent Application WO/2010/061586
Kind Code:
A1
Abstract:
A resin composition for sealers as well as a resin composition for sealers and a paint composition for sealers that contain said resin composition for sealers are useful for sealers to be used with such inorganic building materials as ceramic-based building materials. The resin emulsion for sealers is a resin emulsion which contains emulsion particles having an inner layer and an outer layer. The inner layer is formed with a polymer which is formulated by means of emulsion polymerization of a monomer component containing styrene and a monomer other than said styrene, and the outer layer is formed with a polymer which is formulated by means of emulsion polymerization of a monomer component containing a carboxyl-group-containing monomer and a monomer other than said carboxyl-group-containing monomer.

Inventors:
NAKAO, Kanji (LTD. 5-8 Nishi Otabi-cho, Suita-sh, Osaka 12, 〒5648512, JP)
中尾貫治 (〒12 大阪府吹田市西御旅町5番8号 株式会社日本触媒内 Osaka, 〒5648512, JP)
Application Number:
JP2009/006341
Publication Date:
June 03, 2010
Filing Date:
November 25, 2009
Export Citation:
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Assignee:
NIPPON SHOKUBAI CO., LTD. (1-1 Koraibashi 4-chome, Chuo-ku Osaka-sh, Osaka 43, 〒5410043, JP)
株式会社日本触媒 (〒43 大阪府大阪市中央区高麗橋四丁目1番1号 Osaka, 〒5410043, JP)
NAKAO, Kanji (LTD. 5-8 Nishi Otabi-cho, Suita-sh, Osaka 12, 〒5648512, JP)
International Classes:
C09D125/08; C08F2/44; C08F257/02; C09D5/02; C09K3/10
Attorney, Agent or Firm:
AKAMATSU, Yoshihiro (Takadono 2-chome Asahi-ku, Osaka-sh, Osaka 31, 〒5350031, JP)
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