Title:
RESIN FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD, METAL FOIL PROVIDED WITH RESIN, COVERLAY FILM, BONDING SHEET, AND FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2016/114287
Kind Code:
A1
Abstract:
The present invention pertains to a resin film for a flexible printed circuit board, the resin film comprising: a long-chain alkyl bismaleimide resin having a main chain including an alkylene chain that has a carbon number of 10 or more, and a side chain including an alkyl group bonded to the alkylene chain; and a resin composition containing a curing agent having two or more functional groups for reacting with the long-chain alkyl bismaleimide resin.
Inventors:
TAKEUCHI MASAKI (JP)
MATSUURA YOSHITSUGU (JP)
NAKANO YUTA (JP)
OBATA KAZUHITO (JP)
YASU KATSUHIKO (JP)
MATSUURA YOSHITSUGU (JP)
NAKANO YUTA (JP)
OBATA KAZUHITO (JP)
YASU KATSUHIKO (JP)
Application Number:
PCT/JP2016/050789
Publication Date:
July 21, 2016
Filing Date:
January 13, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H05K1/03; B32B15/08; B32B15/088; B32B27/26; B32B27/34; C08K5/00; C08L35/00
Domestic Patent References:
| WO2013077397A1 | 2013-05-30 | |||
| WO2014181456A1 | 2014-11-13 |
Foreign References:
| JP2012116954A | 2012-06-21 | |||
| JP2005141084A | 2005-06-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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