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Patent Searching and Data


Title:
RESIN FILM FOR INTERLAYER INSULATING LAYER WITH SUPPORT, MULTILAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/216247
Kind Code:
A1
Abstract:
The present invention relates to a resin film for an interlayer insulating layer with a support comprising the support, and a resin composition layer provided on one surface of the support, wherein the support has particles exposed on the one surface and the average maximum height of the portion in which the particles are exposed is 1.0 μm or less, or the support does not have any particles exposed on the one surface. The present invention also relates to a multilayer printed circuit board that uses the resin film for an interlayer insulating layer with a support, and the multilayer printed circuit board.

Inventors:
SUZUKAWA TAKAYUKI (JP)
SUGAWARA IKUO (JP)
IRINO TETSUROU (JP)
TEZUKA YUUKI (JP)
MATSUURA MASAHARU (JP)
Application Number:
PCT/JP2019/017704
Publication Date:
November 14, 2019
Filing Date:
April 25, 2019
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H05K3/46; B32B27/20
Domestic Patent References:
WO2016129655A12016-08-18
WO2003006553A12003-01-23
WO2018016534A12018-01-25
Foreign References:
JP2016069519A2016-05-09
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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